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LSM6DSOXTR IMUs – Inertial Measurement Units iNEMO inertial module Machine Learning Core, Finite State Machine & advanced Dig

LSM6DSOXTR  IMUs – Inertial Measurement Units iNEMO inertial module Machine Learning Core, Finite State Machine & advanced Dig Featured Image
  • LSM6DSOXTR  IMUs – Inertial Measurement Units iNEMO inertial module Machine Learning Core, Finite State Machine & advanced Dig

Short Description:

Manufacturers: STMicroelectronics
Product Category:IMUs – Inertial Measurement Units
Data Sheet: LSM6DSOXTR
Description: Sensors
RoHS status: RoHS Compliant


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Product Tags

♠ Product Description

Product Attribute Attribute Value
Manufacturer: STMicroelectronics
Product Category: IMUs - Inertial Measurement Units
RoHS:  Details
Mounting Style: SMD/SMT
Package / Case: LGA-14L
Sensor Type: 6-axis
Interface Type: Serial
Output Type: Digital
Acceleration: 2 g, 4 g, 8 g, 16 g
Resolution: 16 bit
Sensitivity: 0.488 mg/LSB
Minimum Operating Temperature: - 40 C
Maximum Operating Temperature: + 85 C
Supply Voltage - Min: 1.71 V
Supply Voltage - Max: 3.6 V
Operating Supply Current: 550 uA
Packaging: Reel
Packaging: Cut Tape
Packaging: MouseReel
Brand: STMicroelectronics
Moisture Sensitive: Yes
Product Type: IMUs - Inertial Measurement Units
Range: 125 dps, 250 dps, 500 dps, 1000 dps, 2000 dps
Sensing Axis: X, Y, Z
Series: LSM6DSOX
Factory Pack Quantity: 5000
Subcategory: Sensors
Tradename: iNemo
Unit Weight: 0.000466 oz

♠ iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

The LSM6DSOX is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DSOX supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes,while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DSOX has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.

The LSM6DSOX fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI, configurable for both the gyroscope and accelerometer. The LSM6DSOX OIS can be configured from the Auxiliary SPI and primary interface (SPI / I²C & MIPI I3CSM).

High robustness to mechanical shock makes the LSM6DSOX the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSOX is available in a plastic land grid array (LGA) package.


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  • • Power consumption: 0.55 mA in combo high-performance mode

    • “Always-on” experience with low power consumption for both accelerometer and gyroscope

    • Smart FIFO up to 9 kbyte

    • Android compliant

    • ±2/±4/±8/±16 g full scale

    • ±125/±250/±500/±1000/±2000 dps full scale

    • Analog supply voltage: 1.71 V to 3.6 V

    • Independent IO supply (1.62 V)

    • Compact footprint: 2.5 mm x 3 mm x 0.83 mm

    • SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization

    • Auxiliary SPI for OIS data output for gyroscope and accelerometer

    • OIS configurable from Aux SPI, primary interface (SPI / I²C & MIPI I3CSM)

    • Advanced pedometer, step detector and step counter

    • Significant Motion Detection, Tilt detection

    • Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click

    • Programmable finite state machine: accelerometer, gyroscope and external sensors

    • Machine Learning Core

    • S4S data synchronization

    • Embedded temperature sensor

    • ECOPACK®, RoHS and “Green” compliant

    • Motion tracking and gesture detection

    • Sensor hub

    • Indoor navigation

    • IoT and connected devices

    • Smart power saving for handheld devices

    • EIS and OIS for camera applications

    • Vibration monitoring and compensation

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