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LCMXO2-4000HC-4TG144C Field Programmable Gate Array 4320 LUTs 115 IO 3.3V 4 Spd

LCMXO2-4000HC-4TG144C Field Programmable Gate Array 4320 LUTs 115 IO 3.3V 4 Spd Featured Image
  • LCMXO2-4000HC-4TG144C Field Programmable Gate Array 4320 LUTs 115 IO 3.3V 4 Spd

Short Description:

Manufacturers: Lattice Semiconductor Corporation
Product Category: Embedded – FPGAs (Field Programmable Gate Array)
Data Sheet: LCMXO2-4000HC-4TG144C
Description: IC FPGA 114 I/O 144TQFP
RoHS status: RoHS Compliant


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Product Detail

Features

Product Tags

♠ Product Description

Product Attribute Attribute Value
Manufacturer: Lattice
Product Category: FPGA - Field Programmable Gate Array
RoHS: Details
Series: LCMXO2
Number of Logic Elements: 4320 LE
Number of I/Os: 114 I/O
Supply Voltage - Min: 2.375 V
Supply Voltage - Max: 3.6 V
Minimum Operating Temperature: 0 C
Maximum Operating Temperature: + 85 C
Data Rate: -
Number of Transceivers: -
Mounting Style: SMD/SMT
Package / Case: TQFP-144
Packaging: Tray
Brand: Lattice
Distributed RAM: 34 kbit
Embedded Block RAM - EBR: 92 kbit
Maximum Operating Frequency: 269 MHz
Moisture Sensitive: Yes
Number of Logic Array Blocks - LABs: 540 LAB
Operating Supply Current: 8.45 mA
Operating Supply Voltage: 2.5 V/3.3 V
Product Type: FPGA - Field Programmable Gate Array
Factory Pack Quantity: 60
Subcategory: Programmable Logic ICs
Total Memory: 222 kbit
Tradename: MachXO2
Unit Weight: 0.046530 oz

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  • 1. Flexible Logic Architecture
     Six devices with 256 to 6864 LUT4s and 18 to 334 I/O
    2. Ultra Low Power Devices
     Advanced 65 nm low power process
     As low as 22 μW standby power
     Programmable low swing differential I/O
     Stand-by mode and other power saving options
    3. Embedded and Distributed Memory
     Up to 240 kbits sysMEM™ Embedded Block RAM
     Up to 54 kbits Distributed RAM
     Dedicated FIFO control logic
    4. On-Chip User Flash Memory
     Up to 256 kbits of User Flash Memory
     100,000 write cycles
     Accessible through WISHBONE, SPI, I2C and JTAG interfaces
     Can be used as soft processor PROM or as Flash memory
    5. Pre-Engineered Source Synchronous I/O
     DDR registers in I/O cells
     Dedicated gearing logic
     7:1 Gearing for Display I/O
     Generic DDR, DDRX2, DDRX4
     Dedicated DDR/DDR2/LPDDR memory with DQS support
    6. High Performance, Flexible I/O Buffer
     Programmable sysI/O™ buffer supports wide range of interfaces:
     LVCMOS 3.3/2.5/1.8/1.5/1.2
     LVTTL
     PCI
     LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL
     SSTL 25/18
     HSTL 18
     MIPI D-PHY Emulated
     Schmitt trigger inputs, up to 0.5 V hysteresis
     I/O support hot socketing
     On-chip differential termination
     Programmable pull-up or pull-down mode
    7. Flexible On-Chip Clocking
     Eight primary clocks
     Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only)
     Up to two analog PLLs per device with fractional-n frequency synthesis
     Wide input frequency range (7 MHz to 400 MHz)
    8. Non-volatile, Infinitely Reconfigurable
     Instant-on – powers up in microseconds
     Single-chip, secure solution
     Programmable through JTAG, SPI or I2C
     Supports background programming of non-volatile memory
     Optional dual boot with external SPI memory
    9. TransFR™ Reconfiguration
     In-field logic update while system operates
    10. Enhanced System Level Support
     On-chip hardened functions: SPI, I2C, timer/counter
     On-chip oscillator with 5.5% accuracy
     Unique TraceID for system tracking
     One Time Programmable (OTP) mode
     Single power supply with extended operating range
     IEEE Standard 1149.1 boundary scan
     IEEE 1532 compliant in-system programming
    11. Broad Range of Package Options
     TQFP, WLCSP, ucBGA, csBGA, caBGA, ftBGA, fpBGA, QFN package options
     Small footprint package options
     As small as 2.5 mm x 2.5 mm
     Density migration supported
     Advanced halogen-free packaging

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