STM32F411RET6 ARM Microcontrollers MCU STM32 Dyn Eff MCU 512 K 100 MHz CPU

Short Description:

Manufacturers: STMicroelectronics
Product Category: Embedded – Microcontrollers
Data Sheet: STM32F411RET6
Description: IC MCU 32BIT 512KB FLASH 64LQFP
RoHS status: RoHS Compliant


Product Detail

Features

Product Tags

♠ Product Description

Product Attribute Attribute Value
Manufacturer: STMicroelectronics
Product Category: ARM Microcontrollers - MCU
RoHS:  Details
Series: STM32F411RE
Mounting Style: SMD/SMT
Package / Case: LQFP-64
Core: ARM Cortex M4
Program Memory Size: 512 kB
Data Bus Width: 32 bit
ADC Resolution: 12 bit
Maximum Clock Frequency: 100 MHz
Number of I/Os: 50 I/O
Data RAM Size: 128 kB
Supply Voltage - Min: 1.7 V
Supply Voltage - Max: 3.6 V
Minimum Operating Temperature: - 40 C
Maximum Operating Temperature: + 85 C
Packaging: Tray
Analog Supply Voltage: 1.7 V to 3.6 V
Brand: STMicroelectronics
Data RAM Type: RAM
Interface Type: I2C, SPI, USART, USB
Length: 10 mm
Moisture Sensitive: Yes
Number of ADC Channels: 16 Channel
Processor Series: STM32F411xE
Product: MCU+FPU
Product Type: ARM Microcontrollers - MCU
Program Memory Type: Flash
Factory Pack Quantity: 960
Subcategory: Microcontrollers - MCU
Tradename: STM32
Watchdog Timers: Watchdog Timer
Width: 10 mm
Unit Weight: 0.012088 oz

♠ Arm® Cortex®-M4 32b MCU+FPU, 125 DMIPS, 512KB Flash, 128KB RAM, USB OTG FS, 11 TIMs, 1 ADC, 13 comm. interfaces

The STM32F411XC/XE devices are based on the high-performance Arm® Cortex® -M4 32- bit RISC core operating at a frequency of up to 100 MHz. The Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision dataprocessing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32F411xC/xE belongs to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.

The STM32F411xC/xE incorporate high-speed embedded memories (up to 512 Kbytes of Flash memory, 128 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB bus and a 32-bit multi-AHB bus matrix.

All devices offer one 12-bit ADC, a low-power RTC, six general-purpose 16-bit timers including one PWM timer for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces.

• Up to three I2Cs

• Five SPIs

• Five I2Ss out of which two are full duplex. To achieve audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL or via an external clock to allow synchronization.

• Three USARTs

• SDIO interface

• USB 2.0 OTG full speed interface The STM32F411xC/xE operate in the - 40 to + 125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.

These features make the STM32F411xC/xE microcontrollers suitable for a wide range of applications:

• Motor drive and application control

• Medical equipment

• Industrial applications: PLC, inverters, circuit breakers

• Printers, and scanners

• Alarm systems, video intercom, and HVAC

• Home audio appliances

• Mobile phone sensor hub


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  • Dynamic Efficiency Line with BAM (Batch Acquisition Mode)
    – 1.7 V to 3.6 V power supply
    – – 40°C to 85/105/125 °C temperature range

    • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions

    • Memories
    – Up to 512 Kbytes of Flash memory
    – 128 Kbytes of SRAM

    • Clock, reset and supply management
    – 1.7 V to 3.6 V application supply and I/Os
    – POR, PDR, PVD and BOR
    – 4-to-26 MHz crystal oscillator
    – Internal 16 MHz factory-trimmed RC
    – 32 kHz oscillator for RTC with calibration
    – Internal 32 kHz RC with calibration

    • Power consumption
    – Run: 100 µA/MHz (peripheral off)
    – Stop (Flash in Stop mode, fast wakeup time): 42 µA Typ @ 25C; 65 µA max
    @25 °C
    – Stop (Flash in Deep power down mode, slow wakeup time): down to 9 µA @ 25 °C; 28 µA max @25 °C
    – Standby: 1.8 µA @25 °C / 1.7 V without RTC; 11 µA @85 °C @1.7 V
    – VBAT supply for RTC: 1 µA @25 °C

    • 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels

    • General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support

    • Up to 11 timers: up to six 16-bit, two 32-bit timers up to 100 MHz, each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer

    • Debug mode
    – Serial wire debug (SWD) & JTAG interfaces
    – Cortex®-M4 Embedded Trace Macrocell™

    • Up to 81 I/O ports with interrupt capability
    – Up to 78 fast I/Os up to 100 MHz
    – Up to 77 5 V-tolerant I/Os

    • Up to 13 communication interfaces
    – Up to 3 x I2C interfaces (SMBus/PMBus)
    – Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN,
    IrDA, modem control)
    – Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), SPI2 and SPI3 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock
    – SDIO interface (SD/MMC/eMMC)
    – Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with on-chip PHY

    • CRC calculation unit

    • 96-bit unique ID

    • RTC: subsecond accuracy, hardware calendar

    • All packages (WLCSP49, LQFP64/100, UFQFPN48, UFBGA100) are ECOPACK®2

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