STM32F412VGT6 MCU STM32 Dynamic Efficiency MCU BAM High Performance and DSP FPU

Short Description:

Manufacturers: STMicroelectronics
Product Category: Embedded – Microcontrollers
Data Sheet: STM32F412VGT6
Description: IC MCU 32BIT 1MB FLASH 100LQFP
RoHS status: RoHS Compliant


Product Detail

Features

Product Tags

♠ Product Description

Product Attribute Attribute Value
Manufacturer: STMicroelectronics
Product Category: ARM Microcontrollers - MCU
RoHS:  Details
Series: STM32F412VG
Mounting Style: SMD/SMT
Package / Case: LQFP-100
Core: ARM Cortex M4
Program Memory Size: 1 MB
Data Bus Width: 32 bit
ADC Resolution: 12 bit
Maximum Clock Frequency: 100 MHz
Number of I/Os: 81 I/O
Data RAM Size: 256 kB
Supply Voltage - Min: 1.7 V
Supply Voltage - Max: 3.6 V
Minimum Operating Temperature: - 40 C
Maximum Operating Temperature: + 85 C
Packaging: Tray
Brand: STMicroelectronics
Moisture Sensitive: Yes
Product Type: ARM Microcontrollers - MCU
Factory Pack Quantity: 540
Subcategory: Microcontrollers - MCU
Tradename: STM32
Unit Weight: 0.024037 oz

♠ Arm®-Cortex®-M4 32b MCU+FPU, 125 DMIPS, 1MB Flash, 256KB RAM, USB OTG FS, 17 TIMs, 1 ADC, 17 comm. interfaces

STM32F412XE/G devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision dataprocessing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

STM32F412XE/G devices belong to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing even more power consumption saving during data batching.

STM32F412XE/G devices incorporate high-speed embedded memories (up to 1 Mbyte of Flash memory, 256 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.

All devices offer one 12-bit ADC, a low-power RTC, twelve general-purpose 16-bit timers, two PWM timers for motor control and two general-purpose 32-bit timers.

They also feature standard and advanced communication interfaces:
• Up to four I2Cs, including one I2C supporting Fast-Mode Plus
• Five SPIs
• Five I2Ss of which two are full duplex. To achieve audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL, or via an external clock to allow synchronization.
• Four USARTs
• An SDIO/MMC interface
• A USB 2.0 OTG full-speed interface
• Two CANs.

In addition, STM32F412xE/G devices embed advanced peripherals:
• A flexible static memory controller interface (FSMC)
• A Quad-SPI memory interface
• A digital filter for sigma modulator (DFSDM), two filters, up to four inputs, and support of microphone MEMs.

STM32F412xE/G devices are offered in 7 packages ranging from 48 to 144 pins. The set of available peripherals depends on the selected package.

The STM32F412xE/G operates in the -40 to +125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving modes allows the design of low-power applications.

These features make the STM32F412xE/G microcontrollers suitable for a wide range of applications:

• Motor drive and application control

• Medical equipment

• Industrial applications: PLC, inverters, circuit breakers

• Printers, and scanners

• Alarm systems, video intercom, and HVAC

• Home audio appliances

• Mobile phone sensor hub

• Wearable devices

• Connected objects

• Wifi modules


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  • • Dynamic Efficiency Line with BAM (Batch Acquisition Mode)

    • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions

    • Memories
    – Up to 1 Mbyte of Flash memory
    – 256 Kbyte of SRAM
    – Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory
    – Dual mode Quad-SPI interface

    • LCD parallel interface, 8080/6800 modes

    • Clock, reset and supply management
    – 1.7 V to 3.6 V application supply and I/Os
    – POR, PDR, PVD and BOR
    – 4-to-26 MHz crystal oscillator
    – Internal 16 MHz factory-trimmed RC
    – 32 kHz oscillator for RTC with calibration
    – Internal 32 kHz RC with calibration

    • Power consumption
    – Run: 112 µA/MHz (peripheral off)
    – Stop (Flash in Stop mode, fast wakeup time): 50 µA Typ @ 25 °C; 75 µA max
    @25 °C
    – Stop (Flash in Deep power down mode, slow wakeup time): down to 18 µA @
    25 °C; 40 µA max @25 °C
    – Standby: 2.4 µA @25 °C / 1.7 V without RTC; 12 µA @85 °C @1.7 V
    – VBAT supply for RTC: 1 µA @25 °C

    • 1×12-bit, 2.4 MSPS ADC: up to 16 channels

    • 2x digital filters for sigma delta modulator, 4x PDM interfaces, stereo microphone support

    • General-purpose DMA: 16-stream DMA

    • Up to 17 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window),
    one SysTick timer

    • Debug mode
    – Serial wire debug (SWD) & JTAG
    – Cortex®-M4 Embedded Trace Macrocell™

    • Up to 114 I/O ports with interrupt capability
    – Up to 109 fast I/Os up to 100 MHz
    – Up to 114 five V-tolerant I/Os

    • Up to 17 communication interfaces
    – Up to 4x I2C interfaces (SMBus/PMBus)
    – Up to 4 USARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN,
    IrDA, modem control)
    – Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces
    – SDIO interface (SD/MMC/eMMC)
    – Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY
    – 2x CAN (2.0B Active)

    • True random number generator

    • CRC calculation unit

    • 96-bit unique ID

    • RTC: subsecond accuracy, hardware calendar

    • All packages are ECOPACK®2

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